Infineon, Fairchild set for compatibility deal

LONDON: An agreement between Infineon Technologies AG and Fairchild Semiconductor International Inc. was announced to create compatibility amongst their power MOSFET packages. Particularly the agreement includes the Infineon PowerStage 3x3 and Fairchild MLP 3x3 packages.

This agreement is answer to the requirement for supply security whilst balancing the drive towards superior efficiency and thermal performance in DC-DC conversion. It takes benefit of the proficiency both companies present for asymmetric, dual and single MOSFETs for DC-DC applications from 3 to 20 amps.

Richard Kuncic, director and product line manager for low voltage MOSFETs at Infineon said in a statement "Standardizing power packages benefits our clients as we curtail the amount of unique packages available in the market, whilst offering solutions that improve performance levels in smaller type factors than the earlier generations,".

John Bendel, Fairchild's senior vice president of low voltage products, in the same statement  said "Fairchild and Infineon have standardized the pin-out and have corresponding performance levels, offering clients two sources for their high competence design requirements in the computing, telecom and server markets,".

The companies did not affirm which package or packages had been changed to accomplish the compatibility.