GSA begins 3-D chip, MEMS processes

SANTA CLARA, USA: Initiatives have been launched in -D silicon and MEMS by the Global Semiconductor Alliance, which also has plans to expand in Japan. The 3-D chip initiative is of much importance, because the GSA aims at helping to accelerate the adoption of the technology, which is said to be a potential game changer, but is also one that faces many steep challenges.

The fabless semiconductor trade association has hired executives and has formulated initiatives to form industry working groups that will educate and possibly set standards around supply chain issues for 3-D and MEMS. The association also plans to name to its board an executive from a leading chip company in Japan and hold its first executive event in Japan March 1, according to EE Times.

The 3-D silicon initiative of GSA has consultant Herb Reiter heading it. This aims to accelerate adoption of through silicon vias (TSVs) to link stacked silicon die. Groups like Sematech and IMEC have been leading the charge in researching the manufacturing issues for through-silicon vias, it added.

Silicon vias are already being used in digital cameras to link CMOS imagers, DSPs and memories. But they use vias spaced 20-50 microns apart. The industry needs to develop a mainstream capability to support two-micron via spacing, say sources.

Along with saving several orders of magnitude in chip power, this technology could also guarantee space savings. Sources at the association say that people should be aware of how to prepare for 3-D and how it affects the supply chain.