TSMC, ARM sign strategic agreement

Related Articles

ARM signs FinFET process deal with TSMC

TSMC dismisses reports on SMIC intervention

TSMC to venture into LEDs

TSMC denies buying Nikon 193-nm litho scanner

The agreement provides TSMC access to optimize the implementation of ARM processors on TSMC process technologies

TAIPEI, TAIWAN: Contract chipmaker TSMC (Taiwan Semiconductor Manufacturing Company) and British chip designer ARM said on Tuesday they had signed a long-term strategic agreement, combining the two companies' chip expertise to boost their competitiveness.

The agreement provides TSMC with access to a broad range of ARM processors and enables the development of ARM physical IP across TSMC technology nodes, said a press release. This agreement supports the companies' mutual customers to achieve optimized Systems-On-Chip (SoC) based on ARM processors and covers a wide range of process nodes extending down to 20nm.

The agreement provides TSMC access to optimize the implementation of ARM processors on TSMC process technologies, including ARM Cortex processor family and CoreLink interconnect fabric for AMBA protocols.

It also establishes a long-term relationship with ARM for the development of physical IP, including memory products and standard cell libraries targeting the most advanced TSMC 28nm and 20nm processes, the release added.

“The signing of this agreement is a significant semiconductor industry milestone because it formalizes a forward looking, long-term relationship between two of the industry's leading companies,” explained Mike Inglis, executive vice president and general manager, ARM Processor Division.

“I am pleased that ARM and TSMC will be working together to enable ARM processor based SoCs leveraging both companies' advanced technologies,” he added.

ARM and TSMC will collaborate on creating TSMC technology optimized processor core implementations for benchmarking of optimal power, performance and area.

“We believe this effort will enhance the value of our Open Innovation Platform that efficiently empowers innovation throughout the supply chain,” said Dr. Fu-Chieh Hsu, vice president of Design and Technology Platform and Deputy Head of R&D at TSMC.

“The combination of ARM's industry leading IP and TSMC's world-class technology and manufacturing provides our mutual customers with compelling benefits for advanced semiconductor applications,” he added.

Notify me of follow-up comments via e-mail address

Post

Send this article by email

X