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EV Group unveils high-volume-manufacturing photoresist processing system

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ev-group

This is for logic and memory advanced packaging applications

ST. FLORIAN, AUSTRIA: EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, unveiled its most advanced 300-mm photoresist processing system for logic and memory high-volume manufacturing (HVM) - the EVG150XT resist coating and developing system.

Leveraging EVG's XT Frame platform utilized across the spectrum of the company's industry-leading systems, the EVG150XT is optimized for ultra-high throughput and productivity - bringing the company's expertise in lithography processing to HVM environments.

The EVG150XT is designed for processing resists, spin-on dielectrics and thick films for mid-end-of-line (MEOL) and back-end-of-line (BEOL) semiconductor applications, including through silicon via (TSV) formation, wafer bumping, redistribution layer and interposer manufacturing for 2.5 and 3D-IC packaging.

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