ARM signs FinFET process deal with TSMC

BANGALORE, INDIA: In order to optimise next generation 64bit ARM processor cores for FinFET process technology, ARM Holding and TSMC have signed a multi-year agreement. The agreement extends their collaboration beyond the 20nm node, which TSMC is preparing to start manufacturing in 2013, reports Peter Clarke of EETimes.

TSMC is not going to introduce a FinFET manufacturing process until a 16nm manufacturing process. Both the companies have not disclosed about the process nodes that has been covered by the agreement.

UMC, its rival foundry has licensed a 20nm FinFET manufacturing process from IBM. The agreement between ARM and TSMC specifically covers the delivery of ARM processor cores on a FinFET manufacturing process. It covers 64bit ARM processors based on the ARMv8 architecture, Artisan physical IP and TSMC's FinFET process for use in mobile and enterprise markets.

TSMC needs real-world designs to fine tune and prove its FinFET process and ARM gets early validation of its designs and a chance to optimise the designs for power, performance and area, thereby encouraging early adoption by licensees.

"By working closely with TSMC, we are able to leverage TSMC's ability to quickly ramp volume production of highly integrated SoCs in advanced silicon process technology," said Simon Segars, executive vice president and general manager of ARM's processor and physical IP divisions.

"This collaboration brings two industry leaders together earlier than ever before to optimise our FinFET process with ARM's 64bit processors and physical IP. We can successfully achieve targets for high speed, low voltage and low leakage, thereby satisfying the requirements of our mutual customers and meeting their time-to-market goals." said Cliff Hou, vice president of TSMC R&D.