Amkor's next-gen package on package platform

CHANDLER, USA: Amkor Technology Inc. will introduce its highly anticipated next generation package on package (PoP) platform at the IMAPS Device Packaging Conference March 9–12 in Scottsdale. This new PoP platform uses Amkor’s proprietary through mold via (TMV) interconnect technology to meet challenging next generation high density PoP requirements.

"3D packaging and PoP represent real bright spots for the electronics industry. We are seeing a strong trend for integration of communications, computing and entertainment features into new mobile multimedia devices. We expect these applications to require higher density signal processing and memory capacities while striving to retain the logistics benefits the PoP architecture provides," said Lee Smith, vice president of business development at Amkor.

Amkor’s TMV PoP technology is expected to provide several key benefits:

* Enables scaling of the PoP stacked interface to 0.4mm pitch in support of emerging high density memory architectures.

* Allows for larger silicon area within an existing package footprint benefiting both system architects and IC designers.

* Supports flip chip, wirebond, stacked die and passive integration within the bottom package for increased integration and design flexibility.

* Provides for reduced package warpage enabling thinner PoP stacks and improved surface mount assembly for high density fine pitch applications.

“Amkor has been investing in the building blocks of our TMV approach for a number of years and we are pleased to bring this powerful new technology to market,” commented Tim Olson, senior vice president of R&D and emerging technologies for Amkor. “We have successfully passed our internal qualification and are making preparations to support our ramp into production. We have also initiated the JEDEC registration process to facilitate industry standardization."