Altera showcasing transceiver innovations

SAN JOSE, USA: Altera Corp. will discuss how its innovations in semiconductor design are paving the way for its Generation 10 products to enable the evolution of next-generation networks at DesignCon 2014.

Altera experts in high-speed SERDES, signal integrity, jitter and packaging technology will showcase Altera technologies being developed today and how they will drive future high-speed communications systems, including CFP4 optical module interconnects, 56 Gbps chip-to-chip interconnects, 25+ Gbps backplane and heterogeneous multi-chip integration.

Altera participation at DesignCon 2014 includes in-booth silicon demonstrations, panel discussions, paper presentations and tutorials.

The industry-leading transceiver technology Altera offers todayforms the backbone of high-end networks and communications infrastructure. Altera's transceiver technology delivers the industry's highest serial bandwidth, enabling the evolution of backplane and high-speed optical networking systems.

The innovations Altera has made in transceiver technology over generations of products provide the foundation for future development of transceivers to drive CEI-56G links that will offer the connectivity to drive the next generation of 400G optical networks, 400G line cards and beyond.

At DesignCon 2014, Altera is demonstrating in silicon several key capabilities that will be offered as part of the company's Generation 10 portfolio of products, including a 25G backplane demonstration and an interoperability demonstration between a Stratix V FPGA and next-generation low-cost, low-power CFP4 modules.