ASE SPIL rubbish Citi report on headhunting

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ASE, SPIL rubbish Citi report on headhunting

The report added that SPIL has been strong enough in developing the copper wire bonding technology

Monday, October 19, 2009

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TAIPEI, TAIWAN:Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), the two major players among the Taiwan-based chip packaging houses, have strongly rubbished a report that spoke of head hunting.

A Citi Investment Research report saying that SPIL has hunted a number of staff specializing in copper wire bonding from ASE had created a furore prompting the two companies to deny such a move.

According to the research report on October 12 by Citi Investment Research, ASE was "looking to convert gold process to copper for customers' low-pin-count devices such as consumer and handset ICs, with the process reaching mature yields ahead of Amkor Technology and other peers".

The report added that SPIL has been strong enough in developing the copper wire bonding technology, and successfully recruited 10-20 copper wire-bonding process engineers from ASE.

Just ahead of the report being released, ASE, on October 15, filed with the Taiwan Stock Exchange (TSE) saying that it has not lost any copper wire-bonding process engineers to competitors. Adding to this, SPIL dismissed the Citi research report saying that they are in fact no headhunting moves as the report claimed.

In the meantime, SPIL has spruced up its copper wire bonding process after having bagged orders from as many as 10 clients.

©CIOL Bureau

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