ALBANY, USA: SEMATECH, a global consortium of chipmakers, and Tokyo Ohka Kogyo Co. Ltd (TOK), a leading manufacturer of photoresists, announced that TOK has joined SEMATECH's Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany.

The RMDC's mission is to develop resist and materials for 22 nm patterning technologies and beyond, and consists of both extreme ultraviolet (EUV) exposure capability and a portfolio of sponsored university research programs. TOK will team with researchers at SEMATECH to develop and demonstrate EUV materials and resists for use at the 22 nm node and beyond.

At the RMDC, leading resist and materials suppliers have access to SEMATECH's two micro-exposure tools (METs) located at the University at Albany's College of Nanoscale Science and Engineering and University of California at Berkeley, and can participate in focused, cooperative R&D with SEMATECH member companies. They also have access to the several metrology tools located in SEMATECH's RMDC.

"The RMDC brings together the critical capabilities needed to enable manufacturable EUV," said Bryan Rice, director of Lithography at SEMATECH. "Partnering with resist suppliers such as TOK will accelerate EUV resist development and, in turn, will support timely EUVL introduction."