SAN JOSE, USA: SEMI has published eight new technical standards applicable to the semiconductor, flat panel display (FPD) and MEMS manufacturing industries.

The new standards, developed by technical experts from equipment and materials suppliers, device manufacturers and other companies participating in the SEMI International Standards Program, are available for purchase in CD-ROM format or can be downloaded from the SEMI Web site.

SEMI Standards are published three times a year. The new standards, part of the November 2007 publication cycle, join more than 770 standards that have been published by SEMI during the past 34 years.

"These new SEMI Standards include two MEMS related documents, joining three other MEMS standards that have been available since Spring 2007," said Bettina Weiss, SEMI director of International Standards. "As the MEMS industry grows and technical requirements become clearer, it is important for suppliers and MEMS producers to collaborate in developing these important documents."

The standards released today include guidelines for precursors used in low-K CVD processes, a guide for equipment training best practices, and a test method to determine the strength of wafer-wafer bonds. The full list of SEMI Standards released today include:

SEMI C62 -- Guideline for Porogen Precursors Used in Low K CVD Processes

SEMI C63 -- Guideline for Organosilicate Precursors Used in Low K CVD Processes

SEMI E54.20 -- Standard for Sensor/Actuator Network Communications for EtherCAT

SEMI E150 -- Guide for Equipment Training Best Practices

SEMI F104 -- Particle Test Method Guidelines for Evaluation of Components Used In Ultrapure Water and Liquid Chemical Distribution Systems

SEMI F105 -- Guide for Metallic Material Compatibility in Gas Distribution Systems

SEMI MS4 -- Standard Test Method for Young's Modulus Measurements

SEMI MS5 -- Test Method to Determine Strength of Wafer-Wafer Bonds

The SEMI Standards Program, established in 1973, covers all aspects of semiconductor process equipment and materials, from wafer manufacturing to test, assembly and packaging, in addition to the manufacture of flat panel displays and micro-electromechanical systems (MEMS). About 1,100 volunteers worldwide participate in the program, which is made up of 17 global technical committees.