BANGALORE, INDIA: Justin Rattner, VP and Senior Fellow CTO, Intel Corp., recently highlighted the various innovations Intel has created over the years and continues to do so, while speaking at the CXO Forum organized by the India Semiconductor Association (ISA).

There are some hurdles to innovation. For instance, success brings conservatism and then, there is the curse of high-volume manufacturing. It led to Andy Grove's famous statement: "Only the paranoid survive". Obviously, massive inertia and innovation do not blend. Rattner mentioned certain external hurdles, especially, anti-Innovation policies and standards that hamper innovation.

Moore's Law drives innovation
Moore's Law has been driving innovation at Intel. These have been in the form of high-K metal gate transistors at 45nm -- the first new transistor architecture in 35 years! There's more, in form of phase change memory (PCM) below 45nm, non-planar tri-gate transistor beyond 32nm, and carbon nanotube transistor.

Some recent multi-disciplinary innovations include 45nm Core 2 Duo, Nehalem uArch, power management, quad core through package technology, Silverthorne/LPIA, USB/PCI Express, vPro, and WiMAX and 802.11n, respectively. Intel has made sustained Advances in silicon technology. In 2007, it developed 32nm SRAM with 1.9 billion transistors, with 32nm slated for 2009.

Sustained advances in micro-architecture include Intel Core -- new microarchitecture 65nm (2006), Penryn compaction/derivative at 45nm (2007), Nehalem -- new microarchitecture 45nm (2008), Westmere compaction/derivative 32nm (2009), and Sandy Bridge new microarchitecture 32nm (2010). "This shows our sustained microprocessor leadership," added Rattner.

There are plans to further reinvigorate Intel architecture -- by high throughput computing, IA programmability, ease of scaling for software, array of enhanced IA cores, and increasing teraflops of performance. Its 45nm Silverthorne is based on the Menlow platform and promises 'Full Internet in Your Pocket.'

Intel has also made advances in integration and packaging, such as multi chip packages, Wifi + WiMAX, processor + chipsets + accelerators, 60 percent smaller CPU packages, and 100 percent lead-free technology*. By 2008, Intel is committed to having all 45nm CPUs halogen free.