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RoHS on categories 8 and 9
This article looks at how categories 8 and 9 of the WEEE can be included within the scope of RoHS
Gary Nevison, Premier Farnell
Sunday, August 17, 2008

©CIOL Bureau

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Paul said on 9/2/2008 9:08:23 PM:
RoHS is a perfect example of well-meaning but fundamentally flawed bureacratic interference with technical issues. Its a fiasco and I wish the electronics industry would have had the backbone to tell Geneva to stick it. Bloody bean counters, creating tons of dangerously unreliable equipment because someone waved the "lead = bad" flag. (Just try not to chew on your circuit boards, you bozos.)
to Paul
Dale said on 8/29/2008 11:07:39 PM:
The long-term (>3year) reliablility of Pb-free solder remains uncertain. Ceramic ball grid array (BGA) packages, in particular, are suffering solder ball fractures due to the thermal expansion difference between the fiberglass PWB and the ceramic package. We have also seen tin whiskers of >3mm on a tin-plated copper heatsink, in about six months. Repair/rework of Pb-free BGA packages is much more difficult, leading to higher scrap rates. How does that help the environment?
to Dale
Rob said on 8/18/2008 4:26:36 PM:
Do Indian makers of such products look at RoHS requirements? Where do these source components?
to Rob
Ed said on 8/17/2008 12:58:17 AM:
Great article on RoHS and how some products can get under RoHS review
to Ed

 
 
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