MUNICH, WIMAX WORLD EUROPE: Sequans Communications, a leading WiMAX chipmaker, has announced the availability of its newest chip, the SQN1170, which integrates baseband, RF, and memory in a single chip. Sequans also announced that Mitsumi, leading system-in-package module maker, is the first to use the chip to develop an SDIO module comprising full mobile WiMAX system functionality.

The SDIO module offers manufacturers a complete and highly flexible solution to quickly build high performance, low power-consuming Mobile WiMAX end user devices.  The SDIO module is the first of several modules Mitsumi is  developing based on Sequans' SQN1170.  It is on display at WiMAX World Europe, Sequans' booth 411, May 20-21.

The SQN1170 measures 12X12 mm2 and delivers high throughput of more than 30 Mbps with very low power, consuming less than 600 mW total power in peak MIMO mode. The Mitsumi SDIO module measures a mere 400 mm2, integrating with the SQN1170 all components necessary to deliver full Mobile WiMAX system functionality.

The SQN1170 can be used to build all types of mobile devices--from mobile phones to embedded PC applications to SDIO modules for consumer electronics devices. It also easily enables integrated combination designs such as WiFi/WiMAX half MiniCards with standard PCB and assembly technologies.

The SQN1170 is the sixth Mobile WiMAX chip Sequans has delivered, following a Mobile WiMAX Wave 1 chip in 2006, two baseband Mobile WiMAX Wave 2 chips in 2007 for base station and mobile stations and two RF chips (2.5GHz and 3.5GHz).

 "We are very pleased to be working with Mitsumi," said Georges Karam, Sequans CEO. "The high level of integration, small size, and total Mobile WiMAX system functionality of the SDIO module make it one of the most valuable solutions for WiMAX device makers in the market today."

"The SQN1170 represents the latest significant step in Sequans' product evolution strategy," he added.