Globalfoundries bags ST deal - CIOL News Reports

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Globalfoundries bags ST deal

As per the multi-year manufacturing contract, Globalfoundries is expected to make devices in 40nm low power bulk silicon technology for STMicroelectronics

Thursday, July 30, 2009

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MUNICH: In what could be seen as a big leap for California-based chip manufacturing service provider Globalfoundries, it has bagged a strategic customer contract from STMicroelectronics. As per the multi-year manufacturing contract, Globalfoundries is expected to make devices in 40nm low power bulk silicon technology for STMicroelectronics. This is a first such contract for Globalfoundries, said a market observer.

With the ink now on the dotted line, STMicroelectronics looks at ensuring more than needed capacity for its customers and partners at the leading-edge of power design. STMicroelectronics Chief Technology Officer Jean-Marc Chery added in a statement that "the company needs an agile and high-performance manufacturing partner that can adapt to our changing needs." Chery said ST believes that Globalfoundries can be the right manufacturing partner for leading-edge low power designs for the company.

Globalfoundries will manufacture the devices for ST in its 300-mm Fab 1 located in Dresden in Germany. The joint venture company born out of the collaboration between microprocessor maker AMD and financial investor ATIC, however has declined to elaborate on the financial conditions and its share of capacity reserved for STMicroelectronics.

Meanwhile, market observers have pointed out that ST's foundry partnership doesn't end with Globalfoundries. The company runs several own wafer fabs in France, Italy and Singapore, and also boasts of supply contracts with foundry service providers UMC and TSMC.

©CIOL Bureau

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