TI MIT lays out methodologies for apps processor

BANGALORE, INDIA: Texas Instruments (TI) and the Massachusetts Institute of Technology (MIT) recently presented a joint research paper detailing design methodologies for a 28-nanometer (nm) mobile applications processor at the 2011 International Solid-State Circuits Conference (ISSCC).

The paper -“A 28nm 0.6V Low Power Digital Signal Processor (DSP) for Mobile Applications” demonstrates that it is capable of scaling from high-performance mode at 1.0 volts down to an ultra-low power (ULP) mode at 0.6 volts, said a press release.

This DSP is one of the first system-level, low voltage, 28nm designs for the mobile device market, demonstrating TI’s continued commitment to enabling lower power and extended battery life in mobile devices running advanced applications.

“As the multimedia and computing capabilities of TI’s OMAP platform-based smartphones, tablets and other mobile devices increase, there is a continually expanding gap between performance demands and battery capacity,” said Gordon Gammie, Distinguished Member of the Technical Staff at TI and ISSCC presenter.

He added that the TI believes that 28nm process technology advancements, developed in tandem with TI and MIT’s low power circuit and methodology collaboration, gives them the right knowledge base to successfully meet the next-generation processing demands within the future mobile power envelope.

“The design of a low-voltage processor in 28nm requires a system-level approach – from optimizing the circuit styles and memories to the development of a custom low-voltage timing flow,” said Anantha Chandrakasan, MIT professor and pioneer in the area of low-power design.

He added that the chip demonstrates an aggressive low-power methodology to ensure robust low-voltage and ultra-low-power operation for a smartphone application processor.

TI’s 0.6 V ULP DSP presented in this paper was designed by a team of MIT students and TI engineers, and is an extension of a long-standing joint relationship on low power and ultra-low power research.

“This is an excellent example of the results that come from a long and fruitful collaboration between a university and corporation such as MIT and Texas Instruments,” said Gene Frantz, Principal Fellow at TI.

He added that the students benefit by demonstrating their innovations on complex, DSPs with several million transistors made in state-of-the-art CMOS. TI and its customers benefit from early access to the students’ innovations.

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