New tech on show at Semicon Taiwan 2009

TAIPEI, TAIWAN: As many as twenty-two nations would congregate under one roof with a total of 520 exhibitors displaying their wares at the Semicon Taiwan 2009 semiconductor exhibition that got underway at the Taipei World Trade Center.

Apart from showcasing the innovations and concepts, the participating nations would put on show the latest developments in the semiconductor industry. The innovations that would be made public for the first time will include micro-electromechanical systems (MEMS) and 3D IC testing and packaging equipment.

According to Terry Tsao, president of the Southeast Asia region of the Semiconductor Equipment and Materials International (SEMI), the Taipei showcase would be rich with the inclusion of a China pavilion for the first time.

Semiconductor players from Beijing and Henan Province would be present at the pavilion with their ware. Another significant capsule of the event would be the conduct of forums.

A report from Taipei said that a record number of eight forums will be held during the three-day event. MEMS and 3D IC technology would be among the themes to be addressed in the forums. Testing and packaging having begun to play an increasingly important role, the forums will discuss more on 3D IC technology, which according to semicon players is a crucial technology in the domain.

Meanwhile, the MEMS forum will discuss future technology applications and the trend of the MEMS market, which is likely to be valued at US$10 billion by 2010.

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