Foundry industrys first 28nm SRAMs from UMC

28nm Process Node

Most Commented

Unified Communication for your Biz

Improve your contact center performance. See how you can make a difference.

Watch Now

Reach the ICT Community

Engage and build your ICT audience with CIOL online advertising.

Know more

Foundry industry's first 28nm SRAMs from UMC

Double-patterning immersion lithography and advanced strained-silicon technology used to deliver fully functional 28nm chips

Tuesday, October 28, 2008

Email This

Print This

Comments

RSS

HSINCHU, TAIWAN: UMC, a leading global semiconductor foundry, announced that it has manufactured the foundry industry's first fully functional 28nm SRAM chips.

The chips are based on UMC's independently developed low-leakage (LL) process technology. UMC utilized advanced double-patterning immersion lithography and strained silicon technology to produce the chips, which feature very small six-transistor SRAM cell sizes of approximately 0.122 um2.

"UMC's continued R&D commitment has helped us maintain our leadership position in nanometer technology over the years," said S.C. Chien, vice president of advanced technology development at UMC. "We are excited about this latest achievement for 28nm, as it provides a solid starting point for further development of this technology node towards mainstream availability down the road. Improvements on areas such as minimum supply-voltage, modeling of strain effects, and natural yield will be our focus going forward."

UMC incorporates a dual approach for its 28nm technology to address different market applications. The foundry uses conventional silicon gate/silicon-oxy-nitride gate oxide technology for its LL (low leakage) process, which is ideal for portable applications such as mobile phone ICs.

UMC's second option will utilize a high-k/metal gate stack for speed-intensive products such as graphic, application processor, and high-speed communication ICs. UMC's 28nm process provides almost twice the density of the 40nm technology, which is currently being produced at its 300mm fabs. UMC will also provide foundry services for customized 32nm technologies based on its 28nm process platform.

©CIOL Bureau

Would you like to on this article?

Be first to comment on this article

Name
Email
Your reply

Arrested NASA scientist worked on Chandrayaan-1

China wooing Indian IT companies

Rs.10,000 computer-phone by 2010-end

Polaris eyes emerging mkt post LaserSoft takeover

Windows 7: Should CIOs migrate?

TSMC, Infineon extend partnership

TMIC pact with Elpida Memory stays

Elpida to outsource chips to Taiwan's ProMOS

SmartGuard aims Rs 100 cr revenue in 3 yrs

Nikon, Elpida still waiting on tech recovery

	Simplify Business Management. ERP solutions by IBM
	Carry your Dream, Convey your Value with ZTE
	Get EMC Efficient.Learn more

	Get expert views on Mobilin V2
	How to make your enterprise productive
	Unified Communication can impact business. Know how

	Making Web3.0 a Reality!
	CIOL Enterprise Next :What's NEXT in IT? :
	Decrease Total System Costs With Cyclone IV FPGAs

	Reach your desired Target Audience and realize high ROI
	Effective ways of Customer Acquisition through Demand Generation
	Reach 2,500 potential Enterprise Customers!