TOSEA BOE sign pact - CIOL News Reports

TOSEA, BOE sign pact

BOE Technology requires equipment for the 8.5G fab which it is being built. Its needs for glass substrate will be met by Corning, which is setting up a factory next to its 8.5G LCD factory.

Monday, November 09, 2009

TAIPEI: The Taiwan Optoelectronic and Semiconductors Equipment Association (TOSEA) and BOE Technology, the panel-maker based in China, have signed a letter of intent (LOI) which will enable BOE Technology to get priority regarding equipment sourced from Taiwan for its 8.5G LCD factory.

According to the letter of intent, BOE Technology will be given the priority when the terms of supply offered by members of the Taiwan Optoelectronic and Semiconductors Equipment Association and their competitors are comparable.

In October 2009, representatives from the Taiwan Optoelectronic and Semiconductors Equipment Association TOSEA and 18 members – including Formosa Heavy Industries, Gallant Precision Machining (GPM), Allring, Marketech International, Hermes-Epitek, Manz Intech Machines, Csun Manufacturing, and Wholetech System Hitech – had visited Beijing for a procurement meeting with BOE Technology.

BOE Technology requires equipment for the 8.5G fab which it is being built. Its needs for glass substrate will be met by Corning, which is setting up a factory next to its 8.5G LCD factory.

Besides, BOE Technology requires equipment for its 6G factory in Hefei in China, according sources. The 8.5G plant of BOE Technology has been designed for a monthly capacity of 90,000 glass substrates.

The company has welcomed suppliers who can give it equipment to meet its capacity needs and improve the yield rates at its 8.5G fab.

©CIOL Bureau