TAIPEI, TAIWAN: In a significant development for Phison Electronics, the company has said it is ready with the new NAND flash controller chips for USB flash drives and memory cards which would support Toshiba's 32nm process technology.

With the development complete and ready, the controller IC designer will now look at going for into mass production. It is expecte dthat the decision on mass production would begin soon.

The new product development comes close on the heels of recent rumours that Toshiba's schedule to kick off mass production of 32nm-made NAND flash chips has been delayed. It is a known fact that the Japanese major was originally scheduled to start mass producing 32Gb NAND flash memory using 3-bit per cell (3bpc) 32nm multilevel cell (MLC) class process technology in July.

It had also planned to spruce up production aggressively throughout the first quarter of 2010. Now with Phison's innovation, things have changed.

NAND chips, are in the meanwhile, hogging all the limelight, Korean vendor Samsung Electronics also said to be lining up measures to unveil its 35nm generation NAND flash chips by the end of 2009. Samsung Electronics has already entered the sampling stage. It is expected to ramp up steps to make 32Gb the mainstream density.