BANGALORE, INDIA: Tektronix Inc. recently collaborated with NEC Electronics America, Inc. on the first public showing of NEC Electronics’ new SuperSpeed USB (USB 3.0) device prototypes at the 2009 Consumer Electronics Show.

NEC Electronics, a global leader in the design and production of integrated circuits, worked with Tektronix to prove that its new silicon components meet the requirements of the emerging SuperSpeed USB standard. The working USB 3.0 demonstration featured NEC Electronics’ USB 3.0 PHY test chip and was the industry’s first receiver and transmitter demonstration based on the USB 3.0 Rev1.0 specification. 
 
Stringent interoperability standards, and positive proof of compliance with them, are hallmarks of today’s successful high speed serial bus architectures.  With data rates reaching 5 Gb/s, SuperSpeed USB performance enters the realm of other cutting-edge protocols such as PCI Express® 2.0 and SATA Gen 3.  Testing is a complex measurement challenge that must be answered with instruments having exceptional performance and flexibility, as well as tools that provide speed and simplify setup tasks, measurement steps, and analysis.  The Tektronix SuperSpeed USB solution is the first toolset to meet all the transmitter and receiver test requirements outlined in the SuperSpeed USB specification.
 
"As a leading supplier of USB and PCI Express technologies, NEC Electronics offers all of the building blocks required to develop the next-generation of USB technology, and we are pleased to work with one of the leaders in test and measurement equipment like Tektronix to foster development of the emerging SuperSpeed USB standard," said Kats Nakazawa, general manager, digital consumer and connectivity strategic business unit, NEC Electronics America. "Tektronix provides the SuperSpeed USB ecosystem with much needed test equipment to aid implementation and acceptance of the SuperSpeed USB technology.”
 
“The SuperSpeed USB collaboration between Tektronix and NEC Electronics America puts our commitment behind the new standard,” said Ian Valentine, general manager, Technology Solutions Group, Tektronix.  “Our tools  worked on the front lines with NEC Electronics’ America’s designers, supporting the development of an emerging technology and giving the designers an efficient way to test their silicon for compliance as their devices evolved through the design process.”