TI expands power management portfolio

Power Management

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TI expands power management portfolio

This is meant for OMAP35x processor-based designs

Friday, September 26, 2008

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BANGALORE, INDIA: Building on its power management portfolio targeting embedded processor designs, Texas Instruments Inc. (TI) introduced three fully integrated power management and signal chain companion chips to support all system power requirements of an OMAP35x processor-based design. Combining leading power management circuits with TI's low-power embedded processors results in optimized power and performance, leading to longer battery life and system run-time.

The TPS65920, TPS65930 and TPS65950 devices reduce board space and efficiently manage system power and control for an OMAP35x processor. The TPS65950 supports up to 14-channels of power management conversion. In addition to integrated 3-MHz DC/DC converters and low-noise LDOs, it includes a dual audio codec and drivers, monitor and control features, a battery charger, an LED driver, a 10-bit, 3-input analog-to-digital converter, vibra and keypad functionality, a high-speed USB transceiver with integrated 5-V power supply and an I2C communications interface, all in a 7x7 mm BGA package.

The TPS65920 and TPS65930 devices, which offer a subset of features of the TPS65950, come in a 10 mm x 10 mm package and support up to 8 voltage rails.

The new power companion devices add to the company's growing number of single- and multiple-output voltage regulators that meet the needs of OMAP35x processors. In addition to its TPS659xx family, TI has shipped millions of its tiny, single-output TPS6235x family of 3-MHz DC/DC converters and its multi-output TPS65023 converter, which provide increased flexibility in system optimization for OMAP35x designers.

The TPS659xx, TPS65023 and TPS6235x devices use a dedicated I2C communications interface to enable TI's SmartReflex power and performance management technologies, resulting in additional power savings.

SmartReflex technology-optimized power management
TI's SmartReflex technologies leverage TI's deep sub-micron process geometries to significantly reduce chip-level current leakage in an OMAP35x processor. The technologies incorporate a broad range of intelligent and adaptive hardware and software features that dynamically control voltage, frequency and power based on device activity, modes of operation, and process and temperature variation.

SmartReflex technologies co-ordinate the power consumption and performance of all major system components, including multiple processing cores, hardware accelerators, functional blocks and peripherals. A library of power management cells enables a granular approach to system partitioning of the portable device's power domains.

Finally, SmartReflex technologies provide an open software framework that enables intelligent coordination among lower-level hardware technologies and compatibility with OS-based and third-party power management software.

Leading applications processors for the broad market
Introduced in February, the OMAP35x devices extend the company's proven wireless handset technology to mainstream consumers reaching new markets, such as consumer, embedded and medical. Based on the ARM Cortex-A8 processor, the OMAP35x processors feature combinations of a 2D/3D graphics engine, video accelerators and TMS320C64x+ digital signal processor (DSP) core to provide customers with the industry's best combination of integrated multi-core processing capabilities in a single chip.

The OMAP35x generation of devices consists of four distinct single-chip processors: OMAP3503, OMAP3515, OMAP2525 and OMAP3530. In addition, TI compliments these devices with low-power audio offerings, including codecs, speaker amplifiers and headphone amplifiers. For more information on TI's OMAP35x processors and complimentary analog products.

©CIOL Bureau

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