Powertech and Walton to expand capacities

Powertech and Walton to expand capacities

PTI’s current packaging capacity for DRAM chips stands at 200 million units a month, which the company plans to add to by 30-40 million by the end of 2010

Friday, July 23, 2010

BANGALORE: In order to meet the projected demands of the industry, memory backend service providers Powertech Technology (PTI) and Walton Advanced Engineering reportedly have plans to expand their capacities. According to reports, PTI will be boosting its packaging capacity to 230-240 million DRAM chips a month by the end of 2010, and Walton is to add an additional capacity of 10 million chips starting from July.

PTI’s current packaging capacity for DRAM chips stands at 200 million units a month, which the company plans to add to by 30-40 million by the end of 2010.

Sources say also that PTI is looking to increase outsourcing to contract partner Payton Technology. Payton is a China-based packaging and testing house that is fully owned by Kingston Technology - and subsidiary Macrotech Technology. Payton plans to expand its present monthly capacity of 45 million for DRAM memory to 65 million units at the end of 2010. The company has said previously that they have been seeing clear order visibility through the fourth quarter. Revenues are expected to grow by 20 per cent or more this year, and ramping up of capacity is happening fast enough to match demand.

At Walton, monthly capacity for DRAM will reach 80 million chips later in the third quarter, from the current 70 million units. Their new plant, acquired from Hannstar Display, is to be unveiled on July 23. Revenue and profit performance for 2010 is also reportedly optimistic

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