PARIS, FRANCE: In line with its mission to attract Foreign Direct Investment into the UAE, Dubai Silicon Oasis (DSO), the region’s premier integrated innovations hub for high-tech industries, will target international microelectronics giants at Interconex 2008, taking place in Paris-France on June 24-25, 2008. 

The Dubai Silicon Oasis will utilize the platform of the forum to showcase a continuum of corporate services and highlight its state-of-the-art infrastructure that is tailored to host international technology corporations.

Commenting on this participation, a DSOA official stated that the silicon oasis is committed toward attracting international technology companies.

Its management is confident that the presence of a wide spectrum of microelectronic design and manufacturing companies at Interconex 2008 will be an ideal opportunity to reveal the DSO’s comparative advantages for companies operating out of Dubai in general, and Dubai Silicon Oasis in particular.

Participating in Interconex 2008 is another step for DSOA to showcase its value proposition to global technology industries; thus communicating the growing opportunities in this mounting region that is eager for more technology innovations.

The forum will address topics on materials and new processes including lead-free, polymers, assembly process, intraconnections, PCBs, new technologies, and large BGA packages. Furthermore, advanced packaging and interconnection technologies will be highlighted during the event. Such technologies include SiP, 3D packaging, wafer level, packaging, electronics on flexible support, applications including microsystems, power, medical, telecommunications, automotive industries, modelling, simulation, thermal management, test, reliability and characterization.

DSOA is a wholly-owned entity of the government of Dubai, operating as a free zone technology park for semiconductors, microelectronics and other electronic-based companies looking to set up their regional headquarters and R&D divisions.